New Paper in collaboration with Rigetti Computing
The new paper Entanglement Across Separate Silicon Dies in a Modular Superconducting Qubit Device describes a new method to manufacture large-scale quantum computers out of smaller, specialized modules promises to simplify a number of formidable science and engineering challenges. The team, funded by the DARPA ONISQ program, demonstrated a modular solid state architecture with deterministic inter-module coupling between four physically separate, interchangeable superconducting qubit integrated circuits, that supports the dynamics of pairs of entangled qubits across the four separate silicon dies. Having proven out the fundamental building blocks, this work provides the technological foundations for a modular quantum processor: technology which will accelerate near-term experimental efforts and open up new paths to the fault-tolerant era for solid state qubit architectures.
